- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
Patent holdings for IPC class H01L 23/24
Total number of patents in this class: 559
10-year publication summary
59
|
58
|
46
|
67
|
62
|
31
|
42
|
28
|
15
|
11
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Mitsubishi Electric Corporation | 43934 |
74 |
Fuji Electric Co., Ltd. | 4750 |
43 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
37 |
Infineon Technologies AG | 8189 |
30 |
Samsung Electronics Co., Ltd. | 131630 |
14 |
Micron Technology, Inc. | 24960 |
12 |
STATS ChipPAC Pte. Lte. | 1516 |
10 |
Intel Corporation | 45621 |
9 |
Semiconductor Components Industries, L.L.C. | 5345 |
9 |
Apple Inc. | 50209 |
7 |
Rohm Co., Ltd. | 5843 |
7 |
International Business Machines Corporation | 60644 |
5 |
Toshiba Corporation | 12017 |
5 |
Renesas Electronics Corporation | 6305 |
5 |
Robert Bosch GmbH | 40953 |
5 |
Murata Manufacturing Co., Ltd. | 22355 |
5 |
Nichia Corporation | 3394 |
5 |
Advanced Semiconductor Engineering, Inc. | 1546 |
5 |
Powertech Technology Inc. | 143 |
5 |
Shenzhen Xinguodu Technology Co., Ltd. | 2467 |
5 |
Other owners | 262 |